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IPC-4556A

is a Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards
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This performance specification sets the requirements for the use of Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) as a surface finish for printed boards. This performance specification defines ENEPIG deposit thicknesses for applications including soldering, wire bonding and as a contact finish. It is intended for use by chemical suppliers, printed board manufacturers, electronics manufacturing services (EMS) and original equipment manufacturers (OEM). This standard may be used to specify acceptance criteria to meet performance requirements in addition to those found in the IPC-6010 series (IPC-6012, IPC-6013 and IPC-6018) of standards. The ENEPIG deposit specified by using this document will meet the highest coating durability rating as specified in the J-STD-003 printed board solderability specification.
SDO IPC: IPC by Global Electronics Association
Document Number 4556
Publication Date June 1, 2025
Language en - English
Page Count
Revision Level
Supercedes
Committee
Publish Date Document Id Type View
June 1, 2025 IPC-4556A Revision
Feb. 5, 2013 IPC-4556 Revision
Not Available IPC-4556 Revision