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IPC-4563

Resin Coated Copper Foil for Printed Boards Guideline
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IPC-4563

Resin Coated Copper Foil for Printed Boards Guideline

PUBLISH DATE 2008
IPC-4563
Resin Coated Copper Foil for Printed Boards Guideline
This guideline covers the requirements for resin coated copper foil intended for use in the formation of high density interconnect surface microvias for printed boards and printed board assemblies. 19 pages. Released November 2007.
SDO IPC: IPC by Global Electronics Association
Document Number 4563
Publication Date Feb. 11, 2008
Language en - English
Page Count
Revision Level 0
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Publish Date Document Id Type View
Feb. 11, 2008 IPC-4563 Revision