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IPC-TR-579

Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PWBs
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IPC-TR-579

Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PWBs

PUBLISH DATE 1988
IPC-TR-579
Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PWBs
Approximately 200,000 plated through-holes, covering primarily electroplated but also electroless technology, were exposed to several different thermal cycles. A number of PTH diameters, board constructions and plating thicknesses were evaluated. 80 pages. Released September 1988.
SDO IPC: IPC by Global Electronics Association
Document Number 579
Publication Date Sept. 1, 1988
Language en - English
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Sept. 1, 1988 IPC-TR-579 Revision