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IPC-TR-585

Time, Temperature and Humidity Stress of Final Board Finish Solderability
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IPC-TR-585

Time, Temperature and Humidity Stress of Final Board Finish Solderability

PUBLISH DATE 2006
IPC-TR-585
Time, Temperature and Humidity Stress of Final Board Finish Solderability
This Technical Report details the investigations into identifying stress tests that distinguish between robust and non-robust surface finishes. A robust finish will pass a test for solderability whereas a non-robust finish will fail. The stress tests identified do not necessarily duplicate real world environment (fabrication of the bare printed board through assembly), but they must correlate to solderability performance. The Sequential Electrochemical Reduduction Analysis (SERA) was used extensively to evaluate the solderability performance of the finishes after stress exposure. 54 pages. Released May 2006. This document is only available in electronic format.
SDO IPC: IPC by Global Electronics Association
Document Number 585
Publication Date May 1, 2006
Language en - English
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