IPC-6015

Current Revision
Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting & Interconnecting Structures

Best Price Guarantee Feb 1, 1998 English 87 Pages

Sub Total (1 Item(s)) $ 0.00
Estimated Shipping $ 0.00
Total (Pre-Tax) $ 0.00

You own the digital copy of this edition

View in Library
or
IPC by Global Electronics Association Logo

IPC-6015

Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting & Interconnecting Structures

PUBLISH DATE 1998
IPC-6015
Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting & Interconnecting Structures
Establishes the specific requirements for organic mounting structures used to interconnect chip components, which in combination form the completed functional organic single-chip module (SCM-L) or organic multichip module (MCM-L) assembly. Includes the quality and reliability assurance requirements that must be met for their acquisition. For use with IPC-6011. 25 pages. Released February 1998.
Loading...

Failed to load document history.

Publish Date Document Id Type View