IPC-9202A

Current Revision
Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance Using the IPC-B-52 Test Assembly

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IPC-9202A

Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance Using the IPC-B-52 Test Assembly

PUBLISH DATE 2022
IPC-9202A
Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance Using the IPC-B-52 Test Assembly
The IPC-9202A, Material and Process Characterization/Qualification Test Protocol that records changes in Surface Insulation Resistance (SIR) on a representative sample of a printed circuit assembly (PCA). It quantifies any deleterious effects that might arise from solder flux or other process residues left on external surfaces after soldering, which can cause unwanted electro-chemical reactions that grossly affect reliability.It uses test vehicles that are intended to be representative of the electronic circuits that are in production. It is a test, yielding both quantitative and qualitative data.The IPC-9202A test may be used for Process Qualification, demonstrating that a proposed manufacturing process or process change can produce hardware with acceptable end-item performance related to electrochemical risk. Changes may involve any assembly process step, or a change in the printed board supplier, solder mask or metallization, soldering material supplier, conformal coating, etc. The test vehicle construction will vary depending upon the type of change being evaluated.
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