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IPC-CM-770E

Component Mounting Guidelines for Printed Boards
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IPC-CM-770E

Component Mounting Guidelines for Printed Boards

PUBLISH DATE 2004
IPC-CM-770E
Component Mounting Guidelines for Printed Boards
This revision provides effective guidelines in the preparation and attachment of components for printed circuit board assembly and reviews pertinent design criteria, impacts and issues. It contains techniques for assembly (both manual and machines including SMT, BGA and flip chip) and consideration of, and impact upon, subsequent soldering, cleaning, and coating processes. 150 pages. Revised January 2004.
SDO IPC: IPC by Global Electronics Association
Document Number CM770
Publication Date Jan. 1, 2004
Language en - English
Page Count 157
Revision Level E
Supercedes
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