Logo
Login Sign Up
Current Revision

IPC/JPCA-6801

Terms And Definitions, Test Methods, And Design Examples For Build-Up/High Density Interconnect (HDI) Printed Wiring Boards
Best Price Guarantee

$198.00

2-5 Days

$232.00

SAVE 10%

$387.00


Sub Total (1 Item(s))

$ 0.00

Estimated Shipping

$ 0.00

Total (Pre-Tax)

$ 0.00


or
IPC by Global Electronics Association Logo

IPC/JPCA-6801

Terms And Definitions, Test Methods, And Design Examples For Build-Up/High Density Interconnect (HDI) Printed Wiring Boards

IPC/JPCA-6801
Terms And Definitions, Test Methods, And Design Examples For Build-Up/High Density Interconnect (HDI) Printed Wiring Boards
Terms And Definitions, Test Methods, And Design Examples For Build-Up/High Density Interconnect (HDI) Printed Wiring Boards
SDO IPC: IPC by Global Electronics Association
Document Number 6801
Publication Date Not Available
Language en - English
Page Count
Revision Level 0
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC/JPCA-6801 Revision