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IPC MILMKT12-11-FINFIN

Final Finish for Connectivity
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IPC MILMKT12-11-FINFIN

Final Finish for Connectivity

IPC MILMKT12-11-FINFIN
Final Finish for Connectivity
Final Finish for Connectivity was presented by George Milad of Uyemura International Corporation at the IPC Conference for the PCB Industry: Critical Issues for the Military Market, in December 2011. The author describes surface finishes applied to printed circuit boards to enhance their reliability, solderability, shelf life and the applicability to wire bonding. He also mentions the IPC standards where they apply to the materials. This presentation includes the synchronized slides and audio. 24 minutes. Released 2012.
SDO IPC: IPC by Global Electronics Association
Document Number FINFIN
Publication Date Not Available
Language en - English
Page Count
Revision Level
Supercedes
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