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IPC SMC-WP-003

Chip Mounting Technology
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IPC SMC-WP-003

Chip Mounting Technology

PUBLISH DATE 1993
IPC SMC-WP-003
Chip Mounting Technology
Status of the technology discussion on the various methodologies for mounting and interconnecting active devices to a variety of substrate materials is summarized in this document. Reviews mounting techniques of tape automated bonding (TAB), chip on board (COB) and flip chip. Examinations of the most commonly used substrate options of laminate, ceramic and silicon are also reviewed. Editor: John Biancini, Intercon Corporation. Released by the Surface Mount Council.
SDO IPC: IPC by Global Electronics Association
Document Number 3
Publication Date Aug. 1, 1993
Language en - English
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Revision Level 0
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