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ISO 9455-14:2017

Soft soldering fluxes - Test methods - Part 14: Assessment of tackiness of flux residues
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ISO 9455-14:2017

Soft soldering fluxes - Test methods - Part 14: Assessment of tackiness of flux residues

PUBLISH DATE 2017
ISO 9455-14:2017

ISO 9455-14:2017 specifies a qualitative method for the assessment of the tackiness of the residues of a soft soldering flux after a soldering process. The method is applicable to all fluxes, solder pastes and flux cored solder wires. The method is particularly appropriate for applications where flux residues are left in situ on electrical and electronic equipment.

SDO ISO: International Organization for Standardization
Document Number ISO 9455
Publication Date Aug. 1, 2017
Language en - English
Page Count
Revision Level
Supercedes
Committee ISO/TC 44/SC 12
Publish Date Document Id Type View
Aug. 1, 2017 ISO 9455-14:2017 Revision