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JIS C 63115-2:2022
Sealed nickel-metal hydride cells and batteries for use in industrial applications -- Part 2: Safety
JIS C 63115-2:2022

Sealed nickel-metal hydride cells and batteries for use in industrial applications -- Part 2: Safety

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JIS C 6421:1994
Intermediate frequency transformers for broadcast receiver
JIS C 6421:1994

Intermediate frequency transformers for broadcast receiver

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JIS C 6435:1989
Testing methods for low frequency transformers and inductors
JIS C 6435:1989

Testing methods for low frequency transformers and inductors

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JIS C 6436:1995
Power transformer for electronic equipment
JIS C 6436:1995

Power transformer for electronic equipment

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JIS C 6443:1995
Carbon potentiometers for general use
JIS C 6443:1995

Carbon potentiometers for general use

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JIS C 6444:1991
Variable carbon composition resistors for use in electronic equipment -- Characteristics Y, W and UC
JIS C 6444:1991

Variable carbon composition resistors for use in electronic equipment -- Characteristics Y, W and UC

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JIS C 6445:1995
Wirewound potentiometers
JIS C 6445:1995

Wirewound potentiometers

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JIS C 6461:1996
General rules of variable capacitors for use in electronic equipment
JIS C 6461:1996

General rules of variable capacitors for use in electronic equipment

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JIS C 6462:1996
Test methods of variable capacitors for use in electronic equipment
JIS C 6462:1996

Test methods of variable capacitors for use in electronic equipment

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JIS C 6471:1995
Test methods of copper-clad laminates for flexible printed wiring boards
JIS C 6471:1995

Test methods of copper-clad laminates for flexible printed wiring boards

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JIS C 6472:1995
Copper-clad laminates for flexible printed wiring boards (Polyester film, Polyimide film)
JIS C 6472:1995

Copper-clad laminates for flexible printed wiring boards (Polyester film, Polyimide film)

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JIS C 6480:1994
General rules of copper-clad laminates for printed wiring boards
JIS C 6480:1994

General rules of copper-clad laminates for printed wiring boards

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JIS C 6481:1996
Test methods of copper-clad laminates for printed wiring boards
JIS C 6481:1996

Test methods of copper-clad laminates for printed wiring boards

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JIS C 6482:1997
Copper-clad laminates for printed wiring boards -- Paper base, epoxy resin
JIS C 6482:1997

Copper-clad laminates for printed wiring boards -- Paper base, epoxy resin

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JIS C 6483:1997
Copper-clad laminates for printed wiring boards -- Synthetic fiber fabric base, epoxy resin
JIS C 6483:1997

Copper-clad laminates for printed wiring boards -- Synthetic fiber fabric base, epoxy resin

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JIS C 6484:2005
Base materials for printed circuits -- Epoxide woven E-glass laminated sheets of defined flammability (vertical burning test)
JIS C 6484:2005

Base materials for printed circuits -- Epoxide woven E-glass laminated sheets of defined flammability (vertical burning test)

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JIS C 6485:2008
Base materials for printed circuits -- Paper base, phenolic resin
JIS C 6485:2008

Base materials for printed circuits -- Paper base, phenolic resin

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JIS C 6488:1999
Base materials for printed circuits -- Epoxide cellulose paper core, epoxide glass cloth surfaces copper-clad laminated sheet of defined flammability (vertical burning test)
JIS C 6488:1999

Base materials for printed circuits -- Epoxide cellulose paper core, epoxide glass cloth surfaces copper-clad laminated sheet of defined flammability (vertical burning test)

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JIS C 6489:1999
Base materials for printed circuits -- Epoxide non-woven/woven glass reinforced copper-clad laminated sheet of defined flammability (vertical burning test)
JIS C 6489:1999

Base materials for printed circuits -- Epoxide non-woven/woven glass reinforced copper-clad laminated sheet of defined flammability (vertical burning test)

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JIS C 6490:1998
Base materials for printed circuits -- Polyimide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)
JIS C 6490:1998

Base materials for printed circuits -- Polyimide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)

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JIS C 6492:1998
Base materials for printed circuits -- Bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)
JIS C 6492:1998

Base materials for printed circuits -- Bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)

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JIS C 6493:1999
Base materials for printed circuits -- Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed board
JIS C 6493:1999

Base materials for printed circuits -- Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed board

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JIS C 6494:1999
Base materials for printed circuits -- Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
JIS C 6494:1999

Base materials for printed circuits -- Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

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JIS C 6515:1998
Copper foil for printed wiring boards
JIS C 6515:1998

Copper foil for printed wiring boards

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JIS C 6520:1993
General rules of prepreg for multilayer printed wiring boards
JIS C 6520:1993

General rules of prepreg for multilayer printed wiring boards

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