SAE AMS3731/10 Rev C

Current Revision
POTTING COMPOUND, EPOXY Bisphenol A-Type Unfilled, Room Temperature Cure, Semiflexible

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SAE AMS3731/10 Rev C

POTTING COMPOUND, EPOXY Bisphenol A-Type Unfilled, Room Temperature Cure, Semiflexible

PUBLISH DATE 2017
PAGES 4
SAE AMS3731/10 Rev C

This specification covers an unfilled, room-temperature-polymerizing epoxy resin formulation with a polyamide hardener, supplied as a two-component system.

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