SAE AMS3731/2 Rev D

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Potting Compound, Epoxy Bisphenol A-Type Filled, Heat Cure, Low CTE Thermal Shock Resistant

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Potting Compound, Epoxy Bisphenol A-Type Filled, Heat Cure, Low CTE Thermal Shock Resistant

PUBLISH DATE 2016
PAGES 4

This specification covers a filled epoxy resin formulation, supplied as a two-component system, requiring an oven cure for attainment of maximum properties.

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