SAE ARP6415

Current Revision
Use of Pb-Free Ball Grid Array Component Soldered Using SnPb Solder

Best Price Guarantee Jul 23, 2019 English 32 Pages

Sub Total (1 Item(s)) $ 0.00
Estimated Shipping $ 0.00
Total (Pre-Tax) $ 0.00
View in Library
or
SAE International Logo

Use of Pb-Free Ball Grid Array Component Soldered Using SnPb Solder

PUBLISH DATE 2019
PAGES 32

This document contains information and guidance on the use of Pb-free ball grid arrays (BGAs) in an aerospace, defense, and high performance (ADHP) product, or other products which demand a high reliability.

Loading...

Failed to load document history.

Publish Date Document Id Type View