Techniques for Suspect/Counterfeit EEE Parts Detection by External Visual Inspection, Remarking and Resurfacing, and Surface Texture Analysis Using SEM Test Methods
This document describes the requirements of the following test methods for counterfeit detection of electronic components:
The scope of this document is focused on leaded electronic components, microcircuits, multi-chip modules (MCMs), and hybrids. Other EEE components may require evaluations not specified in this procedure. Where applicable this document can be used as a guide. Additional inspections or criteria would need to be developed and documented to thoroughly evaluate these additional part types.
If AS6171/2 is invoked in the contract, the base document, AS6171 General Requirements shall also apply.
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