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BSI BS EN 60068-2-83:2011

Environmental testing -- Tests. Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
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BSI BS EN 60068-2-83:2011

Environmental testing -- Tests. Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

PUBLISH DATE 2011
PAGES 42
BSI BS EN 60068-2-83:2011
IEC 60068-2-83:2011 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes. Data obtained by these methods are not intended to be used as absolute quantitative data for pass - fail purposes.
NOTE: Different solderability test methods for SMD are described in IEC 60068-2-58 and IEC 60068-2-69. IEC 60068-2-58 prescribes visual evaluation using solder bath and reflow method, IEC 60068-2-69 prescribes wetting balance evaluation using solder bath and solder globule method.
SDO BSI: British Standards Institution
Document Number EN 60068-2-83
Publication Date Nov. 30, 2011
Language en - English
Page Count 42
Revision Level
Supercedes
Committee EPL/501
Publish Date Document Id Type View
Nov. 30, 2011 BS EN 60068-2-83:2011 Revision