Environmental testing -- Tests. Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
IEC 60068-2-83:2025 RLV contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 60068-2-83:2025 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder paste. Data obtained by these methods are not intended to be used as absolute quantitative data for pass/fail purposes.
NOTE: Different solderability test methods for SMD are described in IEC 60068-2-58 and IEC 60068-2-69.
This edition includes the following significant technical change with respect to the previous edition:
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