Logo
Login Sign Up
Current Revision

BSI BS EN 60191-6-20:2010

Mechanical standardization of semiconductor devices -- General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline J-lead packages (SOJ)
Best Price Guarantee
Instant

$222.36

2-5 Days

$222.36

SAVE 10%

$400.25


Sub Total (1 Item(s))

$ 0.00

Estimated Shipping

$ 0.00

Total (Pre-Tax)

$ 0.00


or
British Standards Institution Logo

BSI BS EN 60191-6-20:2010

Mechanical standardization of semiconductor devices -- General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline J-lead packages (SOJ)

PUBLISH DATE 2010
PAGES 16
BSI BS EN 60191-6-20:2010

This part of IEC 60191 specifies methods to measure package dimensions of small outline Jlead-packages (SOJ), package outline form E in accordance with IEC 60191-4.

SDO BSI: British Standards Institution
Document Number EN 60191-6-20
Publication Date Dec. 31, 2010
Language en - English
Page Count 16
Revision Level
Supercedes
Committee EPL/47
Publish Date Document Id Type View
Dec. 31, 2010 BS EN 60191-6-20:2010 Revision