BSI BS EN 60191-6-4:2003

Current Revision
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages -- Measuring methods for package dimensions of ball grid array (BGA)

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BSI BS EN 60191-6-4:2003

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages -- Measuring methods for package dimensions of ball grid array (BGA)

PUBLISH DATE 2003
PAGES 20
BSI BS EN 60191-6-4:2003

IEC 60191-6-4:2003 covers the requirements for the measuring methods of ball grid array (BGA) dimensions.

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