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BSI BS EN 60191-6-4:2003

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages -- Measuring methods for package dimensions of ball grid array (BGA)
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BSI BS EN 60191-6-4:2003

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages -- Measuring methods for package dimensions of ball grid array (BGA)

PUBLISH DATE 2003
PAGES 20
BSI BS EN 60191-6-4:2003
IEC 60191-6-4:2003 covers the requirements for the measuring methods of ball grid array (BGA) dimensions.
SDO BSI: British Standards Institution
Document Number EN 60191-6-4
Publication Date Aug. 4, 2003
Language en - English
Page Count 20
Revision Level
Supercedes
Committee EPL/47
Publish Date Document Id Type View
Aug. 4, 2003 BS EN 60191-6-4:2003 Revision