BSI BS EN 60749-20:2009

Withdrawn Revision

Semiconductor devices. Mechanical and climatic test methods -- Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

Best Price Guarantee Jan 31, 2010 English 32 Pages

This Document Has Been Superseded

A newer publication replaces it: BSI BS EN IEC 60749-20

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BSI BS EN 60749-20:2009

Name: BSI BS EN 60749-20:2009 – Semiconductor devices. Mechanical and climatic test methods -- Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
Brand: British Standards Institution
SKU: BSI BS EN 60749-20:2009
Price: 319.85 USD
Availability: InStock

Semiconductor devices. Mechanical and climatic test methods -- Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

PUBLISH DATE 2010

PAGES 32

IEC 60749-20:2008 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive.

This second edition cancels and replaces the first edition published in 2002 and constitutes a technical revision. The main changes are as follows:

to reconcile certain classifications of IEC 60749-20 and those of IPC/JEDEC J-STD-020C;
reference IEC 60749-35 instead of Annex A of IEC 60749-20, Edition 1;
update for lead-free solder;
correct certain errors in the original Edition 1.