BSI BS EN 61188-5-1:2002

Withdrawn Revision
Printed boards and assemblies. Design and use. Attachment (land/joint) considerations -- Attachment (land/joint) considerations. Generic requirements

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A newer publication replaces it: BSI BS EN IEC 61188-6-1


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BSI BS EN 61188-5-1:2002

Printed boards and assemblies. Design and use. Attachment (land/joint) considerations -- Attachment (land/joint) considerations. Generic requirements

PUBLISH DATE 2003
PAGES 74
BSI BS EN 61188-5-1:2002

Provides information on land pattern geometries used for the surface attachment of electronic components.

The intent of the information presented herein is to provide the appropriate size, shape, and tolerance of surface-mount land patterns to ensure sufficient area for the appropriate solder fillet, and also to allow for inspection, testing, and rework of those solder joints.

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