BSI BS EN IEC 61188-6-1:2021

Current Revision
Circuit boards and circuit board assemblies. Design and use -- Land pattern design. Generic requirements for land pattern on circuit boards

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BSI BS EN IEC 61188-6-1:2021

Circuit boards and circuit board assemblies. Design and use -- Land pattern design. Generic requirements for land pattern on circuit boards

PUBLISH DATE 2021
PAGES 36
BSI BS EN IEC 61188-6-1:2021

IEC 61188-6-1:2021 specifies the requirements for soldering surfaces on circuit boards.

This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components.

These requirements are based on the solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.

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