Semiconductor devices. Micro-electromechanical devices -- Micro-pillar compression test for MEMS materials
This part of IEC 62047 specifies micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication. The uniaxial compressive stress-strain relationship of a specimen is measured, and the compressive modulus of elasticity and yield strength can be obtained.
The test piece is a cylindrical pillar fabricated on a rigid (or highly stiff) substrate by micro-machining technologies, and its aspect ratio (ratio of pillar diameter to pillar height) should be more than 3. This standard is applicable to metallic, ceramic, and polymeric materials.
| SDO | BSI: British Standards Institution |
| Document Number | EN 62047-10 |
| Publication Date | Sept. 30, 2011 |
| Language | en - English |
| Page Count | 18 |
| Revision Level | |
| Supercedes | |
| Committee | EPL/47 |