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BSI BS EN 62258-1:2010

Semiconductor die products -- Procurement and use
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BSI BS EN 62258-1:2010

Semiconductor die products -- Procurement and use

PUBLISH DATE 2010
PAGES 48
BSI BS EN 62258-1:2010
IEC 62258-1:2009 has been developed to facilitate the production, supply and use of semiconductor die products, including:
- wafers,
- singulated bare die,
- die and wafers with attached connection structures,
- minimally or partially encapsulated die and wafers.
This standard defines the minimum requirements for the data that are needed to describe such die products and is intended as an aid to the design of and procurement for assemblies incorporating die products. It covers the requirements for data, including:
- product identity,
- product data,
- die mechanical information,
- test, quality, assembly and reliability information,
- handling, shipping and storage information.
The main changes that have been introduced in this edition have been to ensure consistency across all parts of the standard. The ordering of the subclauses, particularly in Clause 6, has been changed to be more logical and the text of some of the requirements has been amended to add requirements on further information as covered by IEC/TR 62258-4, IEC/TR 62258-7 and IEC/TR 62258-8. New requirements include information on permutability of terminals and functional elements (6.6.4) and moisture sensitivity for partially encapsulated devices (8.8).
SDO BSI: British Standards Institution
Document Number EN 62258-1
Publication Date Nov. 30, 2010
Language en - English
Page Count 48
Revision Level
Supercedes
Committee EPL/47
Publish Date Document Id Type View
Nov. 30, 2010 BS EN 62258-1:2010 Revision
March 7, 2006 BS EN 62258-1:2005 Revision