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BSI BS EN 62258-1:2005

Semiconductor die products -- Procurement and use
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BSI BS EN 62258-1:2005

Semiconductor die products -- Procurement and use

PUBLISH DATE 2006
PAGES 42
BSI BS EN 62258-1:2005
This part of IEC 62258 has been developed to facilitate the production, supply and use of semiconductor die products, including - wafers - singulated bare die - die and wafers with attached connection structures - minimally or partially encapsulated die and wafers This standard defines the minimum requirements for the data which are needed to describe such die products and is intended as an aid in the design of and procurement of assemblies incorporating die products. It covers the requirements for data, including product identity, product data, die mechanical information, test, quality, assembly and reliability information, handling, shipping and storage information.
SDO BSI: British Standards Institution
Document Number EN 62258-1
Publication Date March 7, 2006
Language en - English
Page Count 42
Revision Level
Supercedes
Committee EPL/47
Publish Date Document Id Type View
Nov. 30, 2010 BS EN 62258-1:2010 Revision
March 7, 2006 BS EN 62258-1:2005 Revision