BSI BS EN IEC 60749-5:2024

Current Revision
Semiconductor devices. Mechanical and climatic test methods -- Steady-state temperature humidity bias life test

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BSI BS EN IEC 60749-5:2024

IEC 60749-5:2023 RLV contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC 60749-5:2023 provides a steady-state temperature and humidity bias life test to evaluate the reliability of non-hermetic packaged semiconductor devices in humid environments. This test method is considered destructive.

This edition includes the following significant technical changes with respect to the previous edition:

  • The specification of the test equipment is changed to require the need to minimize relative humidity gradients and maximize air flow between semiconductor devices under test;
  • The specification of the test equipment fixtures is changed to require the avoidance of condensation on devices under test and on electrical fixtures connecting the devices to the test equipment;
  • Replacement of references to β€œvirtual junction” with β€œdie”.
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