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BSI BS EN IEC 60749-5:2024

Semiconductor devices. Mechanical and climatic test methods -- Steady-state temperature humidity bias life test
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IEC 60749-5:2023 is available as IEC 60749-5:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC 60749-5:2023 provides a steady-state temperature and humidity bias life test to evaluate the reliability of non-hermetic packaged semiconductor devices in humid environments. This test method is considered destructive. This edition includes the following significant technical changes with respect to the previous edition: a) The specification of the test equipment is changed to require the need to minimize relative humidity gradients and maximize air flow between semiconductor devices under test; b) The specification of the test equipment fixtures is changed to require the avoidance of condensation on devices under test and on electrical fixtures connecting the devices to the test equipment; c) replacement of references to “virtual junction? with “die?.
SDO BSI: British Standards Institution
Document Number IEC 60749-5
Publication Date Feb. 6, 2024
Language en - English
Page Count 14
Revision Level
Supercedes
Committee EPL/47
Publish Date Document Id Type View
Feb. 6, 2024 BS EN IEC 60749-5:2024 Revision