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BSI BS EN IEC 61189-2-804:2023

Test methods for electrical materials, printed board and other interconnection structures and assemblies -- Test methods for time to delamination. T260, T288, T300
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BSI BS EN IEC 61189-2-804:2023

Test methods for electrical materials, printed board and other interconnection structures and assemblies -- Test methods for time to delamination. T260, T288, T300

PUBLISH DATE 2023
PAGES 14
BSI BS EN IEC 61189-2-804:2023
This International Standard specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyzer (TMA). Temperatures used for this evaluation are typically 260 °C, 288 °C and 300 ºC, but are not limited to these values.
SDO BSI: British Standards Institution
Document Number IEC 61189-2-804
Publication Date Dec. 25, 2023
Language en - English
Page Count 14
Revision Level
Supercedes
Committee EPL/501
Publish Date Document Id Type View
Aug. 30, 2023 BS IEC 61189-2-804:2023 Revision
Dec. 25, 2023 BS EN IEC 61189-2-804:2023 Consolidated