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BSI BS EN IEC 61190-1-3:2018

Attachment materials for electronic assembly -- Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
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BSI BS EN IEC 61190-1-3:2018

Attachment materials for electronic assembly -- Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

PUBLISH DATE 2018
PAGES 50
BSI BS EN IEC 61190-1-3:2018

This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for 'special' electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453. This document is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process.

Special electronic grade solders include all solders which do not fully comply with the requirements of standard solder alloys and solder materials listed herein. Examples of special solders include anodes, ingots, preforms, bars with hook and eye ends, and multiple-alloy solder powders.

SDO BSI: British Standards Institution
Document Number IEC 61190-1-3
Publication Date March 28, 2018
Language en - English
Page Count 50
Revision Level
Supercedes
Committee EPL/501
Publish Date Document Id Type View
March 28, 2018 BS EN IEC 61190-1-3:2018 Revision