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BSI BS IEC 62899-202-7:2021

Printed electronics -- Materials. Printed film. Measurement of peel strength for printed layer on flexible substrate by the 90° peel method
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BSI BS IEC 62899-202-7:2021

Printed electronics -- Materials. Printed film. Measurement of peel strength for printed layer on flexible substrate by the 90° peel method

PUBLISH DATE 2021
PAGES 16
BSI BS IEC 62899-202-7:2021

This part of IEC 62899 provides a test method to measure the peel strength of a printed layer on a flexible substrate. This method calls for peeling the flexible substrate instead of an additional metal electroplating on the printed layer. The method described in this document can be used to compare the peel strengths of the printed layers on the same flexible substrate and thickness conditions. It can be used when the adhesion between the printed layer and flexible substrate is weaker than any other interface between the printed layer and the adhesive, the adhesive and the panel.

SDO BSI: British Standards Institution
Document Number IEC 62899-202-7
Publication Date March 11, 2021
Language en - English
Page Count 16
Revision Level
Supercedes
Committee AMT/9
Publish Date Document Id Type View
March 11, 2021 BS IEC 62899-202-7:2021 Revision