Logo
Login Sign Up
Current Revision

IEC 62899-202-7 Ed. 1.0 en:2021

Printed electronics - Part 202-7: Materials - Printed film - Measurement of peel strength for printed layer on flexible substrate by 90° peel method
Best Price Guarantee

$131.00

2-5 Days

$131.00

SAVE 10%

$235.80


Sub Total (1 Item(s))

$ 0.00

Estimated Shipping

$ 0.00

Total (Pre-Tax)

$ 0.00


or
International Electrotechnical Commission Logo

IEC 62899-202-7 Ed. 1.0 en:2021

Printed electronics - Part 202-7: Materials - Printed film - Measurement of peel strength for printed layer on flexible substrate by 90° peel method

PUBLISH DATE 2021
PAGES 16
IEC 62899-202-7 Ed. 1.0 en:2021
Printed electronics - Part 202-7: Materials - Printed film - Measurement of peel strength for printed layer on flexible substrate by 90° peel method
IEC 62899-202-7:2021(E) provides a test method to measure the peel strength of a printed layer on a flexible substrate. This method calls for peeling the flexible substrate instead of an additional metal electroplating on the printed layer. The method described in this document can be used to compare the peel strengths of the printed layers on the same flexible substrate and thickness conditions. It can be used when the adhesion between the printed layer and flexible substrate is weaker than any other interface between the printed layer and the adhesive, the adhesive and the panel.
SDO IEC: International Electrotechnical Commission
Document Number IEC 62899
Publication Date March 1, 2021
Language en - English
Page Count 16
Revision Level 1.0
Supercedes
Committee 119
Publish Date Document Id Type View
March 1, 2021 Revision
March 1, 2021 IEC 62899-202-7 Ed. 1.0 en:2021 Revision