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IEC 60191-6-18 Ed. 1.0 b:2010

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
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IEC 60191-6-18 Ed. 1.0 b:2010

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

PUBLISH DATE 2026
PAGES 44
IEC 60191-6-18 Ed. 1.0 b:2010
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
IEC 60191-6-18:2010 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger.
SDO IEC: International Electrotechnical Commission
Document Number IEC 60191
Publication Date April 1, 2026
Language b - English & French
Page Count 44
Revision Level 1.0
Supercedes
Committee 47D
Publish Date Document Id Type View
April 1, 2026 IEC 60191-6-18 Ed. 1.0 b:2010 Revision
Jan. 1, 2010 Revision