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Current Corrigendum

IEC 60191-6-18 Ed. 1.0 b Cor.1:2010

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
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IEC 60191-6-18 Ed. 1.0 b Cor.1:2010

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

PUBLISH DATE 2010
PAGES 1
IEC 60191-6-18 Ed. 1.0 b Cor.1:2010
Corrigendum 1 - Mechanical stardardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
SDO IEC: International Electrotechnical Commission
Document Number IEC 60191
Publication Date May 1, 2010
Language b - English & French
Page Count 1
Revision Level 1
Supercedes
Committee 47D
Publish Date Document Id Type View
Jan. 1, 2010 Revision
Jan. 1, 2010 IEC 60191-6-18 Ed. 1.0 b:2010 Revision