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IEC 61760-2 Ed. 3.0 b:2021

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
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IEC 61760-2 Ed. 3.0 b:2021

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

PUBLISH DATE 2021
PAGES 34
IEC 61760-2 Ed. 3.0 b:2021
Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
IEC 61760-2:2021 is available as IEC 61760-2:2021 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 61760-2:2021 specifies the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive. (Conditions for printed boards are not taken into consideration.)
The object of this document is to ensure that users of SMDs receive and store products that can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs can cause deterioration and result in assembly problems such as poor solderability, delamination and "popcorning". Cross-references for references from this edition 3 to the previous edition 2 of this document are listed in Annex X of this document.
SDO IEC: International Electrotechnical Commission
Document Number IEC 61760
Publication Date July 1, 2021
Language b - English & French
Page Count 34
Revision Level 3.0
Supercedes
Committee 91
Publish Date Document Id Type View
Not Available Revision
Not Available Revision
Not Available Revision
July 1, 2021 Revision
July 1, 2021 IEC 61760-2 Ed. 3.0 b:2021 Revision