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Semiconductor devices - Micro-electromechanical devices - Part 43: Test method of electrical characteristics after cyclic bending deformation for flexible micro-electromechanical devices
Semiconductor devices - Micro-electromechanical devices - Part 44: Test methods for dynamic performances of MEMS resonant electric-field-sensitive devices
Semiconductor devices - Micro-electromechanical devices - Part 45: Silicon based MEMS fabrication technology - Measurement method of impact resistance of nanostructures
Semiconductor devices - Micro-electromechanical devices - Part 46: Silicon based MEMS fabrication technology - Measurement method of tensile strength of nanoscale thickness membrane
Semiconductor devices - Micro-electromechanical devices - Part 47: Silicon based MEMS fabrication technology - Measurement method of bending strength of microstructures
Semiconductor devices - Micro-electromechanical devices - Part 48: Test method for determining solution concentration by optical absorption using MEMS fluidic device
Semiconductor devices - Micro-electromechanical devices - Part 49: Temperature and humidity test methods for piezoelectric MEMS cantilevers
Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
Semiconductor devices - Micro-electromechanical devices - Part 50: MEMS capacitive microphones
Semiconductor devices - Micro-electromechanical devices - Part 52: Biaxial tensile testing method for stretchable MEMS
Semiconductor devices - Micro-electromechanical devices - Part 53: MEMS electrothermal transfer device
Semiconductor devices - Micro-electromechanical devices - Part 56: Test method for characteristics of MEMS metal oxide semiconductor (MOS) type gas sensor
Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials
Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection
Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
Electricity metering equipment - General requirements, tests and test conditions - Part 11: Metering equipment
Electricity metering equipment (a.c.) - General requirements, tests and test conditions - Part 21: Tariff and load control equipment
Electricity metering equipment - General requirements, tests and test conditions - Part 31: Product safety requirements and tests
Electricity metering equipment - General requirements, tests and test conditions - Part 41: Energy registration methods and requirements for multi-energy and multi-rate meters
Electricity metering equipment (a.c.) - Particular requirements - Part 11: Electromechanical meters for active energy (classes 0,5, 1 and 2)
Electricity metering equipment - Particular requirements - Part 21: Static meters for AC active energy (classes 0,5, 1 and 2)
Electricity metering equipment - Particular requirements - Part 22: Static meters for AC active energy (classes 0,1S, 0,2S and 0,5S)
Electricity metering equipment - Particular requirements - Part 23: Static meters for reactive energy (classes 2 and 3)
Electricity metering equipment - Particular requirements - Part 24: Static meters for fundamental component reactive energy (classes 0,5S, 1S, 1, 2 and 3)