IPC-7092

Current Revision
Design and Assembly Process Implementation for Embedded Circuitry

Best Price Guarantee 147 Pages

Sub Total (1 Item(s)) $ 0.00
Estimated Shipping $ 0.00
Total (Pre-Tax) $ 0.00

You own the digital copy of this edition

View in Library
or
IPC by Global Electronics Association Logo

IPC-7092

Design and Assembly Process Implementation for Embedded Circuitry

IPC-7092
埋入式元器件涉及和组装工艺的实施
本标准描述了在印制板中以成形或放置方式实现的有源和无源元器件在设计和组装方面的挑战。包括内部电子元器件的完整结构可用于表面贴装和/或通孔元器件连接。在组装过程中,多层结构变成准备为进一步加工的完整产品,它可由有机、无机(陶瓷)或两类兼有的材料制成。
Loading...

Failed to load document history.

Publish Date Document Id Type View