IPC-7351B

Current Revision
Generic Requirements for Surface Mount Design and Land Pattern Standard

Best Price Guarantee Jun 30, 2010 112 Pages

Sub Total (1 Item(s)) $ 0.00
Estimated Shipping $ 0.00
Total (Pre-Tax) $ 0.00

You own the digital copy of this edition

View in Library
or
IPC by Global Electronics Association Logo

IPC-7351B

Generic Requirements for Surface Mount Design and Land Pattern Standard

PUBLISH DATE 2010
IPC-7351B
Generic Requirements for Surface Mount Design and Land Pattern Standard
This popular document covers land pattern design for all types of passive and active components, including resistors, capacitors, MELFs, SOPs, QFPs, BGAs, QFNs and SONs. The standard provides printed board designers with an intelligent land pattern naming convention, zero component rotations for CAD systems and three separate land pattern geometries for each component that allow the user to select a land pattern based on desired component density.Revision B now includes land pattern design guidance and rules for component families such as resistor array packages, aluminum electrolytic capacitors, column and land grid arrays, flat lead devices (SODFL and SOTFL) and dual flat no-lead (DFN) devices. The revision also discusses the usage of thermal tabs and provides a new padstack naming convention that addresses the shape and dimensions of lands on different layers of printed boards.The IPC Land Pattern Calculator is no longer included as of Oct. 1, 2017
Loading...

Failed to load document history.

Publish Date Document Id Type View