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IEC 62326-4 Ed. 1.0 b:1996

Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification
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IEC 62326-4 Ed. 1.0 b:1996

Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification

PUBLISH DATE 1996
IEC 62326-4 Ed. 1.0 b:1996
Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification
Applicable to rigid multilayer printed boards irrespective of their method of manufacture. It is the basis on which agreements between manufacturer and user are to be made. Provides additional information necessary to supplement the requirements of the Generic Specification, IEC 62326-1, for the printed boards intended to be accepted under the IECQ system. Establishes uniform requirements, specifies the characteristics to be assessed and the test methods to be used for quality conformance.
SDO IEC: International Electrotechnical Commission
Document Number IEC 62326
Publication Date Dec. 1, 1996
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 91
Publish Date Document Id Type View
June 5, 2024 Revision
Dec. 1, 1996 IEC 62326-4 Ed. 1.0 b:1996 Revision