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IPC-6013C

Medical Applications Addendum to IPC-6013E Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
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IPC-6013C

Medical Applications Addendum to IPC-6013E Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

PUBLISH DATE 2013
IPC-6013C
Qualification and Performance Specification for Flexible Printed Boards
Covers qualification and performance requirements for flexible printed boards designed to IPC-2221 and IPC-2223. The flexible printed board may be single-sided, double-sided, multilayer or rigid-flex multilayer. All of these constructions may include stiffeners, PTHs, microvias, and blind/buried vias. Revision C incorporates new and updated requirements for final finishes, surface and hole plating, stiffeners, copper filled microvias, cap plating of holes, thermal stress testing, smear removal, and conductor thickness. Supersedes IPC-6013B. For use with IPC-6011. 50 pages. Released November 2013.
SDO IPC: IPC by Global Electronics Association
Document Number 6013
Publication Date Dec. 18, 2013
Language en - English
Page Count
Revision Level C
Supercedes
Committee
Publish Date Document Id Type View
Sept. 1, 2021 IPC-6013E Revision
Sept. 1, 2017 IPC-6013D Revision
Dec. 18, 2013 IPC-6013C Revision
Feb. 10, 2009 IPC-6013B Revision
Not Available IPC-6013A Revision
Not Available IPC-6013 Revision
Not Available IPC-6013E Revision
Not Available IPC-6013D Revision
Not Available IPC-6013D Revision
Not Available IPC-6013B CN Revision
Not Available IPC-6013A DE Revision