Passive RF and microwave devices, intermodulation level measurement - Part 2: Measurement of passive intermodulation in coaxial cable assemblies

Passive RF and microwave devices, intermodulation level measurement - Part 3: Measurement of passive intermodulation in coaxial connectors

Passive RF and microwave devices, intermodulation level measurement - Part 4: Measurement of passive intermodulation in coaxial cables

Passive RF and microwave devices, intermodulation level measurement - Part 5: Measurement of passive intermodulation in filters

Passive RF and microwave devices, intermodulation level measurement - Part 6: Measurement of passive intermodulation in antennas

Passive RF and microwave devices, intermodulation level measurement - Part 7: Field measurements of passive intermodulation

Passive RF and microwave devices, intermodulation level measurement - Part 8: Measurement of passive intermodulation generated by objects exposed to RF radiation

Uninterruptible power systems (UPS) - Part 1: Safety requirements

Uninterruptible power systems (UPS) - Part 2: Electromagnetic compatibility (EMC) requirements

Uninterruptible power systems (UPS) - Part 3: Method of specifying the performance and test requirements

Uninterruptible power systems (UPS) - Part 4: Environmental aspects - Requirements and reporting

Uninterruptible power systems (UPS) - Part 5-3: DC output UPS - Performance and test requirements

Transformers, power supplies, reactors and similar products - EMC requirements

Cores made of soft magnetic materials - Measuring methods - Part 1: Generic specification

Cores made of soft magnetic materials - Measuring methods - Part 2: Magnetic properties at low excitation level

Cores made of soft magnetic materials - Measuring methods - Part 3: Magnetic properties at high excitation level

Safety of machinery - Application of protective equipment to detect the presence of persons

Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions

Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials

Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems

Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures

Semiconductor devices - Micro-electromechanical devices - Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures

Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials

Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods

Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films