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IPC-1601A

Printed Board Handling and Storage Guidelines
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IPC-1601A

Printed Board Handling and Storage Guidelines

IPC-1601A
GuĂ­a para el manejo y almacenamiento de tarjetas impresas
The industry's sole guideline on the handling, packaging and storage of printed boards. The guidelines in this document are intended to protect printed boards from contamination, physical damage, solderability degradation and moisture uptake. Consideration is given to packaging material types and methods, production environment, handling and transport of product, and establishing baking profiles for moisture removal. Revision A provides expanded coverage of moisture barrier bags (MBBs), the impact of baking on printed board solderability, ESD issues, mositure concerns for etched cores and composites, desiccant material and HIC cards, and example flowdowns of packaging and handling requirements. Superseded by IPC-1602
SDO IPC: IPC by Global Electronics Association
Document Number 1061
Publication Date Not Available
Language es - Spanish
Page Count
Revision Level A
Supercedes
Committee
Publish Date Document Id Type View
June 1, 2016 IPC-1601A Revision
Not Available IPC-1601 Revision
Not Available IPC-1601A Revision
Not Available IPC-1601A Revision
Not Available IPC-1601A Revision
Not Available IPC-1601A Revision
Not Available IPC-1601 Revision
Not Available IPC-1601 Revision