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IPC-4101D

Specification for Base Materials for Rigid and Multilayer Printed Boards
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IPC-4101D

Specification for Base Materials for Rigid and Multilayer Printed Boards

PUBLISH DATE 2014
IPC-4101D
SUPERSEDED BY: 4101D-WAM1: Specification for Base Materials for Rigid and Multilayer Printed Boards
This specification covers the requirements for base materials that are referred to as laminate or prepreg. These are to be used primarily for rigid and multilayer printed boards for electrical and electronic circuits. This document contains 64 individual specification sheets that can be searched using keywords. These keywords allow the document's user to find materials of a similar nature, but with specific differing properties that fine-tune their laminate and/or prepreg selection needs. The D revision includes six new specification sheets which reflect the expanded offerings for current commercially available laminates and prepregs with improved or additional properties that are one or more of the following: low-halogen content, high-thermal performance, high speed/high frequency performance or thermally conductivity. Additionally, to keep this revision D current with the global industry, eight specification sheets in the prior revision were removed as they are no longer utilized nor manufactured. 158 pages. Released April 2014.
SDO IPC: IPC by Global Electronics Association
Document Number 4101
Publication Date May 12, 2014
Language en - English
Page Count
Revision Level D
Supercedes
Committee
Publish Date Document Id Type View
March 1, 2017 IPC-4101E Revision
May 12, 2014 IPC-4101D Revision
Aug. 26, 2009 IPC-4101C Revision
June 30, 2002 IPC-4101A Revision
Not Available IPC-4101B Revision
Not Available IPC-4101 Revision
April 1, 2020 IPC-4101E-WAM1 Consolidated
May 12, 2014 IPC-4101D-WAM1 Consolidated
Not Available IPC-4101E Revision
Not Available IPC-4101C Revision
Not Available IPC-4101C Revision
Not Available IPC-4101B WAM 1 and 2-DE Consolidated