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BSI BS EN IEC 60749-20-1:2026

Semiconductor devices ? Mechanical and climatic test methods -- Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
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BSI BS EN IEC 60749-20-1:2026

Semiconductor devices ? Mechanical and climatic test methods -- Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

PUBLISH DATE 2026
PAGES 44
BSI BS EN IEC 60749-20-1:2026

No overview provided by publisher

SDO BSI: British Standards Institution
Document Number IEC 60749-20-1
Publication Date March 9, 2026
Language en - English
Page Count 44
Revision Level
Supercedes
Committee EPL/47
Publish Date Document Id Type View
March 9, 2026 BS EN IEC 60749-20-1:2026 Revision