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BSI PD ES 59008-5-3:2001

Data requirements for semiconductor die. Particular requirements and recommendations for die types -- Minimally-packaged die
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BSI PD ES 59008-5-3:2001

Data requirements for semiconductor die. Particular requirements and recommendations for die types -- Minimally-packaged die

PUBLISH DATE 2001
BSI PD ES 59008-5-3:2001

This European Specification specifies requirements for the exchange of data pertaining to bare semiconductor die with or without connection structures, and minimally-packaged semiconductor die.

This specification also gives recommendations for general industry good practice for handling bare die, with or without connection structures and minimally-packaged die.

ES 59008-5-3 specifies particular requirements and recommendations for minimally-packaged die (MPD) that are not contained elsewhere in this series of specifications.

This specification is for use by semiconductor manufacturers, suppliers, die processors and users of semiconductor die.

ES 59008-5-3 is to be read in conjunction with ES 59008-1, General requirements, with and ES 59008-3, Mechanical, material and connectivity requirements, and, where relevant, with ES 59008-4-1, ES 59008-4-2, ES 59008-4-3 and ES 59008-4-4.

SDO BSI: British Standards Institution
Document Number ES 59008-5-3
Publication Date Dec. 5, 2001
Language en - English
Page Count
Revision Level
Supercedes
Committee EPL/47
Publish Date Document Id Type View
Dec. 5, 2001 PD ES 59008-5-3:2001 Revision