Semiconductor devices - Hot carrier test on MOS transistors

Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)

Semiconductor devices - Metallization stress void test

Control technology - Rules for the designation of measuring instruments

Concentric lay stranded overhead electrical conductors containing one or more gap(s)

Electronics assembly technology - Electronic modules

Type F and type B residual current operated circuit-breakers with and without integral overcurrent protection for household and similar uses

Representation of process control engineering - Requests in P&I diagrams and data exchange between P&ID tools and PCE-CAE tools

Railway applications - Communication, signalling and processing systems - Safety related electronic systems for signalling

Railway applications - Compatibility between rolling stock and train detection systems

Electric power engineering - Modal components in three-phase a.c. systems - Quantities and transformations

Reliability growth - Stress testing for early failures in unique complex systems

Reflectivity of electromagnetic wave absorbers in millimetre wave frequency - Measurement methods

EMC IC modelling - Part 1: General modelling framework

EMC IC modelling - Part 2: Models of integrated circuits for EMI behavioural simulation - Conducted emissions modelling (ICEM-CE)

EMC IC modelling - Part 3: Models of integrated circuits for EMI behavioural simulation - Radiated emissions modelling (ICEM-RE)

EMC IC modelling - Part 4: Models of integrated circuits for RF immunity behavioural simulation - Conducted immunity modelling (ICIM-CI)

EMC IC modelling - Part 6: Models of integrated circuits for pulse immunity behavioural simulation - Conducted pulse immunity modelling (ICIM-CPI)

Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms

Electronic components - Long-term storage of electronic semiconductor devices - Part 3: Data

Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices

Electronic components - Long-term storage of electronic semiconductor devices - Part 6: Packaged or finished devices

Electronic components - Long-term storage of electronic semiconductor devices - Part 7: Micro-electromechanical devices

Electronic components – Long-term storage of electronic semiconductor devices – Part 8: Passive electronic devices

Electronic components - Long-term storage of electronic semiconductor devices - Part 9: Special cases