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IEC 62899-101 Ed. 1.0 en:2019
Printed electronics - Part 101: Terminology - Vocabulary
IEC 62899-101 Ed. 1.0 en:2019

Printed electronics - Part 101: Terminology - Vocabulary

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IEC 62899-201 Ed. 1.1 en:2018
Printed electronics - Part 201: Materials - Substrates
IEC 62899-201 Ed. 1.1 en:2018

Printed electronics - Part 201: Materials - Substrates

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IEC 62899-201-2 Ed. 1.0 en:2021
Printed electronics - Part 201-2: Materials - Substrates - Measurement methods for properties of stretchable substrates
IEC 62899-201-2 Ed. 1.0 en:2021

Printed electronics - Part 201-2: Materials - Substrates - Measurement methods for properties of stretchable substrates

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IEC 62899-202 Ed. 2.0 en:2023
Printed electronics - Part 202: Materials - Conductive ink
IEC 62899-202 Ed. 2.0 en:2023

Printed electronics - Part 202: Materials - Conductive ink

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IEC 62899-202-10 Ed. 1.0 en:2023
Printed electronics - Part 202-10: Materials - Resistance measurement method for thermoformable conducting layer
IEC 62899-202-10 Ed. 1.0 en:2023

Printed electronics - Part 202-10: Materials - Resistance measurement method for thermoformable conducting layer

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IEC 62899-202-11 Ed. 1.0 en:2025
Printed electronics - Part 202-11: Materials - Conductive ink - Measurement method of electrical resistance uniformity for large area printed conductive layer
IEC 62899-202-11 Ed. 1.0 en:2025

Printed electronics - Part 202-11: Materials - Conductive ink - Measurement method of electrical resistance uniformity for large area printed conductive layer

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IEC 62899-202-13 Ed. 1.0 en:2026
Printed electronics - Part 202-13: Materials - Conductive ink - Sheet resistance measurement method for conductive layer in printed and in-mould-electronics
IEC 62899-202-13 Ed. 1.0 en:2026

Printed electronics - Part 202-13: Materials - Conductive ink - Sheet resistance measurement method for conductive layer in printed and in-mould-electronics

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IEC 62899-202-3 Ed. 1.0 en:2019
Printed electronics - Part 202-3: Materials - Conductive ink - Measurement of sheet resistance of conductive films - Contactless method
IEC 62899-202-3 Ed. 1.0 en:2019

Printed electronics - Part 202-3: Materials - Conductive ink - Measurement of sheet resistance of conductive films - Contactless method

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IEC 62899-202-4 Ed. 1.0 en:2021
Printed electronics - Part 202-4: Materials - Conductive ink - Measurement methods for properties of stretchable printed layers (conductive and insulating)
IEC 62899-202-4 Ed. 1.0 en:2021

Printed electronics - Part 202-4: Materials - Conductive ink - Measurement methods for properties of stretchable printed layers (conductive and insulating)

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IEC 62899-202-5 Ed. 1.0 en:2018
Printed electronics - Part 202-5: Materials - Conductive ink - Mechanical bending test of a printed conductive layer on an insulating substrate
IEC 62899-202-5 Ed. 1.0 en:2018

Printed electronics - Part 202-5: Materials - Conductive ink - Mechanical bending test of a printed conductive layer on an insulating substrate

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IEC 62899-202-6 Ed. 1.0 en:2020
Printed electronics - Part 202-6: Materials - Conductive ink - Measurement method for resistance changes under high temperature and humidity - Printed conductive layer on a flexible substrate
IEC 62899-202-6 Ed. 1.0 en:2020

Printed electronics - Part 202-6: Materials - Conductive ink - Measurement method for resistance changes under high temperature and humidity - Printed conductive layer on a flexible substrate

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IEC 62899-202-7 Ed. 1.0 en:2021
Printed electronics - Part 202-7: Materials - Printed film - Measurement of peel strength for printed layer on flexible substrate by 90° peel method
IEC 62899-202-7 Ed. 1.0 en:2021

Printed electronics - Part 202-7: Materials - Printed film - Measurement of peel strength for printed layer on flexible substrate by 90° peel method

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IEC 62899-202-8 Ed. 1.0 en:2024
Printed electronics - Part 202-8: Materials - Conductive ink - Measurement of difference in resistance of printing direction of conductive film fabricated with wire-shaped materials
IEC 62899-202-8 Ed. 1.0 en:2024

Printed electronics - Part 202-8: Materials - Conductive ink - Measurement of difference in resistance of printing direction of conductive film fabricated with wire-shaped materials

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IEC 62899-202-9 Ed. 1.0 en:2023
Printed electronics - Part 202-9: Materials - Conductive ink - Printed patterns for mechanical test
IEC 62899-202-9 Ed. 1.0 en:2023

Printed electronics - Part 202-9: Materials - Conductive ink - Printed patterns for mechanical test

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IEC 62899-203 Ed. 2.0 en:2024
Printed electronics - Part 203: Materials - Semiconductor ink
IEC 62899-203 Ed. 2.0 en:2024

Printed electronics - Part 203: Materials - Semiconductor ink

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IEC 62899-203-2 Ed. 1.0 en:2025
Printed electronics - Part 203-2: Materials - Semiconductor ink - Space charge limited mobility measurement in printed organic semiconductive layers
IEC 62899-203-2 Ed. 1.0 en:2025

Printed electronics - Part 203-2: Materials - Semiconductor ink - Space charge limited mobility measurement in printed organic semiconductive layers

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IEC 62899-204 Ed. 1.0 en:2019
Printed electronics - Part 204: Materials - Insulator ink - Measurement methods of properties of insulator inks and printed insulating layers
IEC 62899-204 Ed. 1.0 en:2019

Printed electronics - Part 204: Materials - Insulator ink - Measurement methods of properties of insulator inks and printed insulating layers

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IEC 62899-301-1 Ed. 1.0 en:2017
Printed electronics - Part 301-1: Equipment - Contact printing - Rigid master - Measurement method of plate master external dimension
IEC 62899-301-1 Ed. 1.0 en:2017

Printed electronics - Part 301-1: Equipment - Contact printing - Rigid master - Measurement method of plate master external dimension

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IEC 62899-301-2 Ed. 1.0 en:2017
Printed electronics - Part 301-2: Equipment - Contact printing - Rigid master - Measurement method of plate master pattern dimension
IEC 62899-301-2 Ed. 1.0 en:2017

Printed electronics - Part 301-2: Equipment - Contact printing - Rigid master - Measurement method of plate master pattern dimension

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IEC 62899-301-3 Ed. 1.0 en:2024
Printed Electronics - Part 301-3: Equipment - Contact printing - Rigid master - Method to measure the shape errors of printing plate rollers
IEC 62899-301-3 Ed. 1.0 en:2024

Printed Electronics - Part 301-3: Equipment - Contact printing - Rigid master - Method to measure the shape errors of printing plate rollers

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IEC 62899-302-1 Ed. 1.0 en:2017
Printed electronics - Part 302-1: Equipment - Inkjet - Imaging based measurement of jetting speed
IEC 62899-302-1 Ed. 1.0 en:2017

Printed electronics - Part 302-1: Equipment - Inkjet - Imaging based measurement of jetting speed

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IEC 62899-302-2 Ed. 1.0 en:2018
Printed electronics - Part 302-2: Equipment - Inkjet - Imaging-based measurement of droplet volume
IEC 62899-302-2 Ed. 1.0 en:2018

Printed electronics - Part 302-2: Equipment - Inkjet - Imaging-based measurement of droplet volume

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IEC 62899-302-3 Ed. 1.0 en:2021
Printed electronics - Part 302-3: Equipment - Inkjet - Imaging-based measurement of drop direction
IEC 62899-302-3 Ed. 1.0 en:2021

Printed electronics - Part 302-3: Equipment - Inkjet - Imaging-based measurement of drop direction

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IEC 62899-302-4 Ed. 1.0 en:2024
Printed electronics - Part 302-4: Medium for inkjet printing dot placement evaluation
IEC 62899-302-4 Ed. 1.0 en:2024

Printed electronics - Part 302-4: Medium for inkjet printing dot placement evaluation

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IEC 62899-302-6 Ed. 1.0 en:2025
Printed electronics - Part 302-6: Equipment - Inkjet - First drop measurement
IEC 62899-302-6 Ed. 1.0 en:2025

Printed electronics - Part 302-6: Equipment - Inkjet - First drop measurement

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