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IEC 62047-22 Ed. 1.0 b:2014

Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
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IEC 62047-22 Ed. 1.0 b:2014

Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates

PUBLISH DATE 2026
PAGES 24
IEC 62047-22 Ed. 1.0 b:2014
Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
IEC 62047-22:2014 specifies a tensile test method to measure electromechanical properties of conductive thin micro-electromechanical systems (MEMS) materials bonded on non-conductive flexible substrates. Conductive thin-film structures on flexible substrates are extensively utilized in MEMS, consumer products, and flexible electronics. The electrical behaviours of films on flexible substrates differ from those of freestanding films and substrates due to their interfacial interactions. Different combinations of flexible substrates and thin films often lead to various influences on the test results depending on the test conditions and the interfacial adhesion. The desired thickness of a thin MEMS material is 50 times thinner than that of the flexible substrate, whereas all other dimensions are similar to each other.
SDO IEC: International Electrotechnical Commission
Document Number IEC 62047
Publication Date April 1, 2026
Language b - English & French
Page Count 24
Revision Level 1.0
Supercedes
Committee 47F
Publish Date Document Id Type View
April 1, 2026 IEC 62047-22 Ed. 1.0 b:2014 Revision
June 19, 2014 Revision