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JEDEC JEP122H

FAILURE MECHANISMS AND MODELS FOR SEMICONDUCTOR DEVICES

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JEDEC JEP122H

FAILURE MECHANISMS AND MODELS FOR SEMICONDUCTOR DEVICES

PUBLISH DATE 2016

JEDEC JEP122H

Document Information

This publication provides a list of failure mechanisms and their associated activation energies or acceleration factors that may be used in making system failure rate estimations when the only available data is based on tests performed at accelerated stress test conditions. The method to be used is the Sum-of-the-Failure-Rates method. This publication also provides guidance in the selection of reliability modeling parameters, namely functional form, apparent thermal activation energy values and sensitivity to stresses such as power supply voltage, substrate current, current density, gate voltage, relative humidity, temperature cycling range, mobile ion concentration, etc. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office.


SDO	JEDEC: LEGACY IMPORT
Document Number
Publication Date	Sept. 1, 2016
Language	en - English
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Publish Date	Document Id	Type	View
Sept. 1, 2016	JEP122H	Revision

SDO	Document	Title
BSI	BSI BS EN IEC 60749-10	Semiconductor devices. Mechanical and climatic test methods -- Mechanical shock. device and subassembly
BSI	BSI BS EN 60749-28	Semiconductor devices. Mechanical and climatic test methods -- Electrostatic discharge (ESD) sensitivity testing. Charged device model (CDM). Device level
BSI	BSI BS EN IEC 60749-28	Semiconductor devices. Mechanical and climatic test methods -- Electrostatic discharge (ESD) sensitivity testing. Charged device model (CDM). device level
IEC	IEC 60749-10	Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - device and subassembly
BSI	BSI BS IEC 60747-14-2	Discrete semiconductor devices and integrated circuits. Semiconductor devices. Semiconductor sensors -- Hall elements
BSI	BSI BS EN 60747-15	Semiconductor devices. Discrete devices -- Isolated power semiconductor devices
BSI	BSI BS EN IEC 60747-15	Semiconductor devices -- Discrete devices. Isolated power semiconductor devices
IEC	IEC 60749-28	Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level
BSI	BSI BS EN 60191-6-22	Mechanical standardization of semiconductor devices -- General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
BSI	BSI BS 3934-1	Mechanical standardization of semiconductor devices -- Recommendations for the preparation of drawings of semiconductor devices
IEC	IEC 60747-15	Semiconductor devices - Part 15: Discrete devices - Isolated power semiconductor devices
BSI	BSI BS IEC 62951-4	Semiconductor devices. Flexible and stretchable semiconductor devices -- Fatigue evaluation for flexible conductive thin film on the substrate for flexible semiconductor devices
IEC	IEC 60191-6-22	Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
BSI	BSI BS EN 60749-38	Semiconductor devices. Mechanical and climatic test methods -- Soft error test method for semiconductor devices with memory
IEC	IEC 62951-4	Semiconductor devices - Flexible and stretchable semiconductor devices - Part 4: Fatigue evaluation for flexible conductive thin film on the substrate for flexible semiconductor devices
BSI	BSI BS EN 60191-6-16	Mechanical standardization of semiconductor devices -- Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
BSI	BSI BS EN 60749-10	Semiconductor devices. Mechanical and climatic test methods -- Mechanical shock
IEC	IEC 60749-38	Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory
BSI	BSI BS EN 60191-4	Mechanical standardization of semiconductor devices -- Coding system and classification into forms of package outlines for semiconductor device packages
BSI	BSI BS 3934-6	Mechanical standardization of semiconductor devices -- Specification for the preparation of outline drawings of surface mounted semiconductor device packages
BSI	BSI BS EN 60191-6-21	Mechanical standardization of semiconductor devices -- General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)
BSI	BSI BS EN 60191-6-5	Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages -- Design guide for fine-pitchball grid array (FBGA)
BSI	BSI BS EN 60191-6-4	Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages -- Measuring methods for package dimensions of ball grid array (BGA)
BSI	BSI BS EN 60191-6-20	Mechanical standardization of semiconductor devices -- General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline J-lead packages (SOJ)
BSI	BSI BS EN 60191-6	Mechanical standardization of semiconductor devices -- General rules for the preparation of outline drawings of surface mounted semiconductor device packages

JEDEC JEP122H

FAILURE MECHANISMS AND MODELS FOR SEMICONDUCTOR DEVICES

JEDEC JEP122H

Document Information

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