A collection of featured documents from our library that are popular among our users or otherwise noteworthy.
Semiconductor devices - Micro-electromechanical devices - Part 31: Four-point bending test method for interfacial adhesion energy of layered MEMS materials
Semiconductor devices - Micro-electromechanical devices - Part 32: Test method for the nonlinear vibration of MEMS resonators
Semiconductor devices - Micro-electromechanical devices - Part 33: MEMS piezoresistive pressure-sensitive device
Semiconductor devices - Micro-electromechanical devices - Part 34: Test methods for MEMS piezoresistive pressure-sensitive device on wafer
Semiconductor devices Micro-electromechanical devices - Part 35: Test method of electrical characteristics under bending deformation for flexible electro-mechanical devices
Semiconductor devices Micro-electromechanical devices Part 36: Environmental and dielectric withstand test methods for MEMS piezoelectric thin films
Semiconductor devices - Micro-electromechanical devices - Part 37: Environmental test methods of MEMS piezoelectric thin films for sensor application
Semiconductor devices - Micro-electromechanical devices - Part 38: Test method for adhesion strength of metal powder paste in MEMS interconnection
Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
Semiconductor devices - Micro-electromechanical devices - Part 40:Test methods of micro-electromechanical inertial shock switch threshold
Semiconductor devices - Micro-electromechanical devices - Part 41: RF MEMS circulators and isolators
Semiconductor devices - Micro-electromechanical devices - Part 42: Measurement methods of electro-mechanical conversion characteristics of piezoelectric MEMS cantilever
Semiconductor devices - Micro-electromechanical devices - Part 43: Test method of electrical characteristics after cyclic bending deformation for flexible micro-electromechanical devices
Semiconductor devices - Micro-electromechanical devices - Part 44: Test methods for dynamic performances of MEMS resonant electric-field-sensitive devices
Semiconductor devices - Micro-electromechanical devices - Part 45: Silicon based MEMS fabrication technology - Measurement method of impact resistance of nanostructures
Semiconductor devices - Micro-electromechanical devices - Part 46: Silicon based MEMS fabrication technology - Measurement method of tensile strength of nanoscale thickness membrane
Semiconductor devices - Micro-electromechanical devices - Part 47: Silicon based MEMS fabrication technology - Measurement method of bending strength of microstructures
Semiconductor devices - Micro-electromechanical devices - Part 48: Test method for determining solution concentration by optical absorption using MEMS fluidic device
Semiconductor devices - Micro-electromechanical devices - Part 49: Temperature and humidity test methods for piezoelectric MEMS cantilevers
Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
Semiconductor devices - Micro-electromechanical devices - Part 50: MEMS capacitive microphones
Semiconductor devices - Micro-electromechanical devices - Part 52: Biaxial tensile testing method for stretchable MEMS
Semiconductor devices - Micro-electromechanical devices - Part 53: MEMS electrothermal transfer device
Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials
Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection
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