Logo
Login Sign Up
Current Revision

IEC 60191-4 Ed. 3.1 b:2018

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
Best Price Guarantee

$673.00

2-5 Days

$673.00

SAVE 10%

$1,211.40


Sub Total (1 Item(s))

$ 0.00

Estimated Shipping

$ 0.00

Total (Pre-Tax)

$ 0.00


or
International Electrotechnical Commission Logo

IEC 60191-4 Ed. 3.1 b:2018

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

PUBLISH DATE 2026
PAGES 158
IEC 60191-4 Ed. 3.1 b:2018
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
IEC 60191-4:2013+A1:2018 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages. The descriptive designator provides a useful communication tool but has no implied control for assuring package interchangeability. This edition includes the following significant technical changes with respect to the previous edition:
a) Material code "S" is added to indicate a silicon based package.
b) Description of "WL" is added to be used for general use. This consolidated version consists of the third edition (2013) and its amendment 1 (2018). Therefore, no need to order amendment in addition to this publication.
SDO IEC: International Electrotechnical Commission
Document Number IEC 60191
Publication Date April 1, 2026
Language b - English & French
Page Count 158
Revision Level 3.1
Supercedes
Committee 47D
Publish Date Document Id Type View
April 1, 2026 IEC 60191-4 Ed. 3.1 b:2018 Revision
April 1, 2026 IEC 60191-4 Ed. 3.0 b:2013 Revision
March 1, 2018 Revision
Oct. 1, 2013 Revision